| 摘要 |
PURPOSE:To speed up a probing process by a method wherein probe card rotating mechanisms are installed on a probe card mount and the attachment angle of a probe card on the probe card mount is adjusted for a proper position before inspection. CONSTITUTION:A probe card 31 mounted with a probe 33 capable of contacting a wafer 23 is held at a prescribed position after automated replacement, and a wafer prober is provided, equipped with a probe mount 27 having rotating mechanisms 43 and 45 for the probe card 31. The probe card 31 is replaced, and the probe card 31 and a wafer mounting stage 25 are cause to make a relative movement to a memorized position, and for alignment the probe 33 is brought into contact with a wafer 23 that has completed travelling. The rotating mechanisms 43 and 45 rotate the wafer mounting stage 25 relatively by theta for positional compensation, and then inspection is accomplished. This saves time and speeds up the probing process.
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