| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode lamp wherein, at a solder DIP process, disconnection of a metal wire is prevented when an LED chip and a lead are connected by wire-bonding. SOLUTION: An LED chip 4 is mounted by die-bonding on the tip of one lead 3S of a pair of leads 2S and 3S while connected to the other lead 2S by wire-bonding with a metal wire 5. The LED chip 4 is packaged with a mold part 6 of transparent or semi-transparent synthetic resin whose tip is formed into a semi-spherical lens. The temperature at solder DIP process transfers through the lead to cause a stress at the lead, where movement of the lead can cause disconnection of the metal wire 5. However, the lead is formed of a metal whose heat conductivity is lower than iron which is normally used as a lead to prevent disconnection of the metal wire 5. |
