| 摘要 |
PURPOSE:To enhance a wire bonding strength, to prevent a short-circuit between two electrodes, and to enhance reliability in the wire bonding by previously removing a conductive part on a wire bonding face to form a fine pattern for confirming the wire bonding position. CONSTITUTION:In a wire bonding method for connecting a wire 3 to a surface to be wire bonded, a conductive part is previously removed on the surface to be wire bonded to form a fine pattern 11 for confirming a wire bonding position. For example, a circular conductive part is previously removed at an inner lead and the surface to be wire bonded of an electrode 2 to form the pattern 11 for confirming the wire bonding position. Further, two patterns 12, 13 made of the same material as that of the electrode 2 are formed in X-, Y-directions of the patterns, and the wire bonding position of the wire 3 is confirmed after wire bonding. |
