| 摘要 |
PURPOSE:To materialize the thinning of a package by lowering the conductive material arranged between the wiring pad of a semiconductor chip and the lead, concerning the semiconductor device of such structure that the wiring pad of the semiconductor chip is connected to the lead. CONSTITUTION:This is constituted by forming the contact between a wiring pad 3, made around a semiconductor chip 1, and a lead 8 at the position lower than the active element formation face of said semiconductor chip l. |
