发明名称 MANUFACTURE AND MANUFACTURING EQUIPMENT FOR RESIN SEALING TYPE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve dispersion characteristics of resin moldings obtained and to prevent island from shifting at the time of sealing resin injection. SOLUTION: A bar-shaped lead frame holding mechanism 10 for clamping and holding the island 4a is provided in a slidable manner from an element mounting side of an island 4a and at its opposite side at two places respectively at lower die chase 21a and upper die chase 21b. The lead frame holding mechanism 10 is driven so as to operate independently from an ejector pin 9. After injecting sealing resin into a cavity and a sealing resin has been hardened, the lead frame holding mechanism, 10 is pulled out, then the upper die chase 21b is separated from the lower die chase 21a, and the resin moldings 8 is separated from the die with an ejector pin 9.
申请公布号 JPH09260410(A) 申请公布日期 1997.10.03
申请号 JP19960093594 申请日期 1996.03.21
申请人 RICOH CO LTD 发明人 AGARI HIRONOBU
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56 主分类号 B29C45/26
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