发明名称 MANUFACTURE OF CERAMIC ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a ceramic electronic part, by which a motherboard can be quickly cut without using any dicer and without a material loss, generation of crack or breakage thereof at the time of cutting. SOLUTION: External electrodes 4a and 4b to be electrically conducted with internal electrodes are attached to a unburned motherboard 30 having the internal electrodes provided within a ceramic. The motherboard 30 is cut at predetermined positions into individual elements 3 and each of the divided elements 3 is burned. In a step of cutting the motherboard 30 into the elements 3, a plate-like cutting edge 16 having at least one side formed with an edge 15 is pushed against the motherboard 30 at a predetermined position to cut the motherboard.
申请公布号 JPH09260187(A) 申请公布日期 1997.10.03
申请号 JP19960090278 申请日期 1996.03.19
申请人 MURATA MFG CO LTD 发明人 NOMICHI TAKASHI;TAKEUCHI SHOZO;YONEDA YASUNOBU
分类号 H01G4/12;H01C7/04;H01C7/10;H01G13/00 主分类号 H01G4/12
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