发明名称 RESIN TRANSFER MOLDING USING A DOUBLE-CHAMBER VACUUM MOLD ASSEMBLY
摘要 A double chamber vacuum resin transfer molding process (100) is provided comprising the initial step of providing a double chamber vacuum resin transfer molding apparatus (10) comprising a first mold portion and a second mold portion. The first mold portion and the second mold portion are configured such that, in an engaged state, the first mold portion and the second mold portion define a mold cavity (50) and a brim cavity (60). The mold cavity (50) is isolated from the brim cavity (60) by a compressible seal (40). Either or both of the first mold portion and the second mold potion are further configured to define an injection gate in communication with the mold cavity (50), a mold cavity vacuum port (32) in communication with the mold cavity (50), and a brim cavity vacuum port (34) in communication with the brim cavity (60). The first mold portion, the second mold portion, and the compressible seal (40) are arranged such that a decrease in brim cavity pressure below atmospheric pressure causes a corresponding decrease in mold cavity volume. A preform (90) is provided and the molding apparatus is arranged in the engaged state such that the preform (90) is positioned in the mold cavity (50). A resin is injected into the mold cavity (50) via the injection gate. The mold cavity (50) and the brim cavity (60) are evacuated so as to compress the compressible seal (40), decrease the brim cavity pressure, decrease the mold cavity volume, and cause the injected resin to infiltrate the preform (90). The resin is cured in the mold cavity (50) by maintaining the evacuated state in the brim cavity (60) for an amount of time sufficient to cure the resin.
申请公布号 WO0006360(A1) 申请公布日期 2000.02.10
申请号 WO1999US16511 申请日期 1999.07.21
申请人 THE UNIVERSITY OF DAYTON 发明人 HAN, KERANG, KEN
分类号 B29C33/00;B29C70/48;(IPC1-7):B29C43/56;B29C67/14 主分类号 B29C33/00
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