发明名称 Polishing apparatus
摘要 A stage is provided with pressing holes arranged circumferentially and suctioning holes arranged circumferentially to be close to the outer peripheral edge side compared to the pressing holes. A cavity connected to these pressing holes and suctioning holes is provided within a wafer holder. In addition, first filters, which allow a gas to flow from the cavity side to the wafer holding surface side, are arranged between the pressing holes and the cavity. Second filters, which allow a gas to flow only from the wafer holding surface side to the cavity side, are arranged between the suctioning holes and the cavity.
申请公布号 GB2336555(B) 申请公布日期 2000.08.30
申请号 GB19990009037 申请日期 1999.04.20
申请人 * NEC CORPORATION 发明人 MITSUYOSHI * UTO
分类号 B24B37/04;B24B37/30;H01L21/683 主分类号 B24B37/04
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