MANUFACTURE OF SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT, AND MANUFACTURE OF SEMICONDUCTOR DEVICE, AND MOUNTING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a bare chip with a recess at an electrode by allowing an electrode conductive part to be exposed, provided with an insulated through- hole. SOLUTION: A through-hole 103 is provided at a pad on a semiconductor element 100, and a protruding electrode 202 on a substrate is inserted in the hole 103. The insert lowers connection energy for connection. A clearance for a bump material in the through hole direction is provided for connection, and the connection is evaluated with the through-hole.