| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable multilayer interconnection board wherein, with a surface multilayer interconnection layer formed on the surface of a core substrate, a moisture- resistance of the core substrate is enhanced and a change rate of resistance is less at an environment-resistance test. SOLUTION: The multilayer interconnection board is provided where a multilayer interconnection layer 6 in which an insulating layer 4 and wiring circuit layer 5 are sequentially laminated is formed on the surface of a core substrate A which comprises insulating layers 1a-1e (at least) comprising at least a thermo-setting resin, wiring circuit layers 2a and 2b embedded at least in one surface of the insulating layers 1a-1e, and a via hole conductor 3. The core substrate A comprises fabric insulating layers 1b, 1c, and 1d containing a thermo-setting resin and fiber, while outermost layers 1a and 1c on front and rear surfaces of the core substrate A are formed of a powder insulating layer containing inorganic powder and thermo-setting resin with no fiber contained. The thickness of powder insulating layers 1a and 1e interposed between the multilayer interconnection layer 6 and fabric insulating layers 1b, 1c, and 1d is 30μm or thicker while being 10-40% of the total thickness of fabric insulating layers 1b, 1c, and 1d. |
