| 摘要 |
A micromechanical module with a sensor (2) and a control-and-evaluation switch (3), arranged on a circuit substrate (4), with a semiconductor chip (5) of circuit substrate embedded in a synthetic plastic composition (6), which has a recess (7) for sensor (2), where recess (7) includes a rubber-elastic synthetic resin composition (8) which covers sensor (3). Independent claims are included for: (1) a sensor housing with a sensor region (13) and a switching region (14), and semiconductor chip (5), embedded in composition (6); (2) a process for production of the module including preparation of circuit substrate (4), application of composition (6) to circuit substrate (3), and introduction of sensor (2) and composition into recess (7). |
