发明名称 VIA CONFIGURABLE ARCHITECTURE FOR CUSTOMIZATION OF ANALOG CIRCUITRY IN A SEMICONDUCTOR DEVICE
摘要 <p>A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.</p>
申请公布号 EP1738412(A1) 申请公布日期 2007.01.03
申请号 EP20050743379 申请日期 2005.04.01
申请人 TRIAD SEMICONDUCTOR, INC.;VIASIC, INC. 发明人 KEMERLING, JAMES, C.;IHME, DAVID;COX, WILLIAM, D.
分类号 H01L27/118;H03K19/177 主分类号 H01L27/118
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