| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method capable of reducing a frequency of work required for changing a kind of components to improve productivity. <P>SOLUTION: In mounting electronic components for carrying and mounting a plurality of kinds of the electronic components while changing a nozzle of a single mounting head corresponding to each kind of the components, a mounting order is determined so that the component finally mounted to each substrate during a component mounting process including stack components (components of kinds A and B) limited in the mounting order and normal components (components of kinds C and D) as objects to be mounted is the normal component. Part of a normal mounting process is carried out by picking up the normal component which can be mounted by the nozzle used in mounting the finally mounted component on a preceding substrate as the initial component on the current substrate. Then, the nozzle is changed to complete a process of mounting the stack components, and thereafter the remaining normal mounting process is carried out for the normal component remained as the component to be finally mounted. <P>COPYRIGHT: (C)2008,JPO&INPIT |
