发明名称 |
Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof |
摘要 |
The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.
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申请公布号 |
US2008315399(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20050575851 |
申请日期 |
2005.09.20 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BAUER MICHAEL;BEMMERL THOMAS;FUERGUT EDWARD;JEREBIC SIMON;STUEMPFL CHRISTIAN;THEUSS HORST;VILSMEIER HERMANN |
分类号 |
H01L23/04;H01L21/00 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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