发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which inhibits an increase of the number of power sources for inspection, makes it possible to supply a power source current over an amount of supply of a power source current of a single power source for inspection, and includes an inspection process that can efficiently, certainly inspect the semiconductor device; and provide a semiconductor device. SOLUTION: The semiconductor device 10 includes semiconductor circuit units 31, 32, 33 which operate at the same power source voltage. Moreover, the semiconductor device 10 includes power source lines 5, 6, 7 on which a power source voltage is applied independent of outside each other. Each of the power source lines 5, 6, 7 has a switch 12 which selectively changes between a non-common state that supplies a power source voltage to each semiconductor circuit units 31, 32, 33 independent of each other and a common state that the power source lines 5, 6 supply a power source voltage to the semiconductor circuit unit 31 at the same time and the power source line 7 supplies a power source voltage to the semiconductor circuit units 32, 33. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009059875(A) 申请公布日期 2009.03.19
申请号 JP20070225636 申请日期 2007.08.31
申请人 PANASONIC CORP 发明人 WAKASHIMA YASUNORI
分类号 H01L21/822;G01R31/28;H01L27/04 主分类号 H01L21/822
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