| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste for a ceramic multilayer circuit board capable of more effectively suppressing an occurrence of warpage when forming a conductor circuit by sintering simultaneously with a ceramic green sheet.SOLUTION: The conductive paste for a ceramic multilayer circuit board is manufactured by atomizing method. The average grain size is within a range of 2 to 9 μm and the maximum grain size is 40 μm or less. The conductive paste contains thin sliced atomization silver flake powder as conductive powder. The atomization silver flake powder is preferably 50 wt.% of the conductive powder or more. |
