| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device and a mounting method in which joining failure and positional deviation are prevented from occurring in the mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed by performing a temporary crimping process and a main crimping process via an adhesive resin.SOLUTION: Provided is a mounting device including a mechanism where a substrate holding stage is alternately moved between a temporary crimping part in which a temporary crimping head is provided and a main crimping part in which a main crimping head is provided in a state where a circuit board is held and also including a control part which finally crimps the chip component to a circuit pattern by moving the substrate holding stage from the lower side of the temporary crimping head to the lower side of the main crimping head after the chip component is temporarily crimped to the circuit pattern. The mounting method is also provided.SELECTED DRAWING: Figure 1 |
