| 摘要 |
A wafer gripping device including a mechanism for automatically gripping a wafer by claws for transporting a wafer between an auxiliary vacuum chamber and a vacuum chamber of a semiconductor etching device. The claws for gripping a wafer have a vertical stroke increased when a wafer gripping operation is performed to enable the wafer to be gripped without any damage being caused thereto. The wafer gripping device includes a dust collection preventing member for minimizing dust collection.
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