发明名称 Chip-like electronic component series
摘要 A chip-like electronic component series retains a plurality of chip-like electronic components (2) distributed along a longitudinal direction of a tape (1). The tape (1) is formed with a plurality of cavities (5) distributed in its longitudinal direction, so that the chip-like electronic components are received in respective ones of the cavities. In order to retain the chip-like electronic components in the cavities, the cavities are covered by a cover sheet (3). Each of the cavities comprises a relatively flat receiving portion (7) having a bottom surface (6) extending along the longitudinal direction of the tape and a projecting receiving portion (8) projecting from a part of the bottom surface of the flat receiving portion. With such configuration, the cavities can retain at least two types of chip-like electronic components of different geometry or retain the chip-like electronic components at least in two types of conditions.
申请公布号 US4633370(A) 申请公布日期 1986.12.30
申请号 US19850707581 申请日期 1985.03.04
申请人 MURATA MANUFACTURING CO., LTD. 发明人 HAMURO, MITSURO;ANAO, KIMIHARU;SHIMAMAKI, KEIICHI
分类号 B65D73/02;B65D75/34;H05K13/00;(IPC1-7):B65D75/24 主分类号 B65D73/02
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