发明名称 |
Chip-like electronic component series |
摘要 |
A chip-like electronic component series retains a plurality of chip-like electronic components (2) distributed along a longitudinal direction of a tape (1). The tape (1) is formed with a plurality of cavities (5) distributed in its longitudinal direction, so that the chip-like electronic components are received in respective ones of the cavities. In order to retain the chip-like electronic components in the cavities, the cavities are covered by a cover sheet (3). Each of the cavities comprises a relatively flat receiving portion (7) having a bottom surface (6) extending along the longitudinal direction of the tape and a projecting receiving portion (8) projecting from a part of the bottom surface of the flat receiving portion. With such configuration, the cavities can retain at least two types of chip-like electronic components of different geometry or retain the chip-like electronic components at least in two types of conditions.
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申请公布号 |
US4633370(A) |
申请公布日期 |
1986.12.30 |
申请号 |
US19850707581 |
申请日期 |
1985.03.04 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
HAMURO, MITSURO;ANAO, KIMIHARU;SHIMAMAKI, KEIICHI |
分类号 |
B65D73/02;B65D75/34;H05K13/00;(IPC1-7):B65D75/24 |
主分类号 |
B65D73/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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