发明名称 PRODUCTION OF ELECTROFORMING MOLD
摘要 PURPOSE:To obtain an electroforming die having a transfer surface faithful to a surface to be transferred by forming a conductive metal coating layer by sputtering on the surface to be transferred of an object to be transferred and forming an electroformed metal layer by electroforming on the surface thereof with said coating layer as a cathode. CONSTITUTION:The conductive coating layer 9 consisting of a metal is stuck and formed by sputtering on the surface to be transferred of the object 3 to be transferred consisting of a hand-woven fabric or the like. Said metal collides in the form of extremely fine particles on the surface to be transferred at this time and, therefore, said metal sticks in the form of the conductive coating layer 9 of an extremely small film thickness securely on the surface to be transferred. The metal, therefore, intrudes into the inside of the fine rugged parts without filling up said parts and forms the above-mentioned coating layer 9 even if the surface to be transferred has the fine rugged parts. Electroforming is then executed with the object to be transferred formed with the coating layer 9 as the cathode, by which the electroformed metal layer 6 as the electroforming die is formed on the surface of the coating layer 9. The electroforming die transferred faithfully with the transfer surface of the object 3 is, therefore obtd. if the object 3 is stripped from the metal layer 6.
申请公布号 JPS63105988(A) 申请公布日期 1988.05.11
申请号 JP19860251096 申请日期 1986.10.21
申请人 TOYODA GOSEI CO LTD;KONAN TOKUSHU SANGYO KK 发明人 TSUTSUI MASATOSHI;NODA YASUYOSHI
分类号 C25D1/00 主分类号 C25D1/00
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