| 摘要 |
A method directed to a system for splitting, imaging and focusing a pulsing laser beam, such as from an excimer laser, onto a workpiece to improve the subsequent metal plating of such workpiece. A preferred technique of laser assisted plating is a system for laser ablating a plurality of contact areas on electrical terminals, where the areas are covered by ablatable resist. The preferred system comprises a carrier strip having a plurality of electrical terminals mounted thereon; a pulsed laser for directing radiation at the carrier strip; a hologram mounted in the radiation path between the laser and the carrier strip for splitting the radiation from the laser into a plurality of radiation beams directed towards the plurality of contact areas; and mechanism for synchronizing the movement of the carrier strip with the pulsing of the laser so that a respective one of the plurality of outgoing beams ablates the resist over a respective one of the contacts as the contact areas move past the hologram.
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