发明名称 |
Ultrasonic bonding or welding of semi-finished prod. - using e.g. solder foils or plastic parts in continuous strip form |
摘要 |
<p>(A) in the ultrasonic bonding and/or welding of pts., at least one of the pts. is a large surface area semi-finished product comprising several pts. in strip and/or interlinked form, the individual pts. being isolated by the ultrasound during bonding and/or welding. (B) Also claimed are (a) a semi-finished prod. of solder foil for use in the process, the solder foil comprising strips (10,20) of predetermined width (B) and lines of weakness of spacing (A); and (b) a semi-finished plastics prod. for use in the process, comprising a strip of interlinked plastics parts with lines of weakness. USE/ADDVANTAGE - The process is useful for welding solder foils to contact pieces in switchgear and for joining injection moulded plastics pts.. It facilitates precise handling and positioning of the pts..</p> |
申请公布号 |
DE4024941(A1) |
申请公布日期 |
1992.02.13 |
申请号 |
DE19904024941 |
申请日期 |
1990.08.06 |
申请人 |
SIEMENS AG, 8000 MUENCHEN, DE |
发明人 |
MOLL, HELMUT, DIPL.-ING., 8520 ERLANGEN, DE;KRAUSE, RALF-DIETER, DIPL.-ING., 8500 NUERNBERG, DE |
分类号 |
B23K20/10;B23K35/14;B29C65/06;B29C65/08 |
主分类号 |
B23K20/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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