| 摘要 |
<p>PURPOSE:To hold the intervals between the conductors of fellow pads by a method wherein the pads correspond to a narrow pitch by providing lands for non-penetration through hole connection use at positions adjacent to the outer peripheries of the pads and the form of the tips of the pads is partially modified. CONSTITUTION:In a multilayer printed-wiring board having pads 1 for surface mounting use and non-penetration through holes 3 adjacent to the pads 1, a land 5 having one non-penetration through hole is provided at a position where is connected with the tip of each pad 1. Moreover, in the case where the land 5 having one non-penetration through hole is provided at the position where is connected with the tip of each pad 1, the form of the other tip of the pad 1 is modified into a round form, whereby the pads are provided so that the intervals between the conductors of the fellow pads 1 can be held.</p> |
