发明名称 METHOD FOR FORMING PLASTIC MEMBER ON LEAD FRAME
摘要 PURPOSE: To provide a method for forming a plastic member on a lead frame by keeping the flatness of lead by minimizing stress applied to a solder node, and preventing the generation of crack and split on the plastic during assembly. CONSTITUTION: An outer terminal part 36 and an inner terminal part 42 are provided and the plastic member is formed on the lead frame having a plurality of leads arranged parallelly. Among the leads, a 1st intermediate dam member 38 is arranged between the outer terminal part 36 and inner terminal part 42 of lead. Among the leads, a 2nd intermediate dam member 40 is arranged between the 1st intermediate dam member 38 of lead and the inner terminal part 42. The 1st intermediate dam member 38 and the 2nd intermediate dam member 40 are arranged so as to divide the leads into the outer terminal part 36, inner terminal part 42 and central part 44. The central part 44 is capsuled into a plastic mold material.
申请公布号 JPH06252316(A) 申请公布日期 1994.09.09
申请号 JP19920188870 申请日期 1992.06.24
申请人 AMERICAN TELEPH & TELEGR CO <ATT> 发明人 RANJITSUTO BISUWASU;MAIKERU EE JIMAAMAN
分类号 B29C45/14;B29L31/34;H01L21/56;H01L23/057;H01L23/495;H01L23/50 主分类号 B29C45/14
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