发明名称 LASER CUTTING DEVICE
摘要 PURPOSE: To correctly machine a cutting groove of the regulated dimension by measuring the cutting width of upper and lower end portions of the cutting groove of a work, comparing the measurement with the specified value, and regulating the clearance between the work and a laser condenser lens and the relative speed. CONSTITUTION: A cutting groove is machined in a work 20 by condensing the laser oscillated by a laser beam oscillator 11 by a condenser lens 12. An optical monitor 51a measures the cutting width P1 at an upper end portion of the cutting groove, and an optical monitor 51b measures the cutting width P2 of a lower portion thereof. A control part 40 compares the measured value W and the specified value. When the measured value W is smaller, a numerical control device 30 elevates the condenser lens 12 by a lens moving means 14. The moving speed of the work 20 is delayed by a machining speed adjusting means 15. Adjustment such as increase in output of the laser beam oscillator 11 is achieved by a power adjusting means 16.
申请公布号 JPH08103880(A) 申请公布日期 1996.04.23
申请号 JP19950031675 申请日期 1995.01.27
申请人 SOU HEISHIYUN 发明人 SOU HEISHIYUN
分类号 B23K26/00;B23K26/03;B23K26/06;B23K26/073;B23K26/08;B23K26/36;B23K26/40;B27M1/06 主分类号 B23K26/00
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