| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board by which multilayer circuit boards can be manufactured successively and which can be labor-saving for preparation. SOLUTION: A pair of film-like laminates 2A, 2B each of which is made by jointing a copper foil and an insulating adhesive material, are formed in belt-like continuous shapes, a plurality of circuit boards 1 are arranged in the longitudinal direction of the film-like laminate 2A, and the film-like laminates 2A, 2B and the circuit board 1 are stacked up to make a multilayer circuit board. The film-like laminates 2A, 2B are gripped by chucks of carrying means and are pulled tight, so that they do not slacken and are moved together with the circuit board 1 into a chamber 13 to be stored there by the carrying means. The chamber 13 is formed by moving a lower board 11 up, and an airtight adhesion and pressurization means 15 is drive to bring a flexible film body 12 into close contact with the film-like laminate 2A, and then the inside of the chamber 13 is decompressed by a suction means 16. The flexible film body 12 is swollen to pressurize the film-like laminates 2A, 2b and the circuit board 1, and the film-like laminates 2A, 2B and the circuit board 1 are heated by a heating means 17 so as to be stacked. |
