| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite-type multilayer wiring board which has high reliability and is suitable for a hybrid integrated circuit by making up for the weaknesses of ceramic multilayer wiring boards and resin multilayer wiring boards by each other, while taking the advantages, and also provide a method for manufacturing such a multilayer wiring board. SOLUTION: A multilayer wiring board 8 is provided with a ceramic wiring element board 4, a resin-wiring element board 5, an insulator layer 6 which, being located between the two wiring element boards 4 and 5, joins and integrates the two wiring element boards, and an interlayer connection section which, being constituted of conductive resin bumps 7, pass through the insulator layer 6 and connect patterns which face each other. Or, alternatively the insulator layer 6 can be replaced with an anisotropic conductive resin layer which selectively passes through the conductive region to electrically connect the facing patterns. |
