| 摘要 |
A heat radiating apparatus for a semiconductor device, in which said semiconductor device mounted on a circuit board is cooled by a radiator. The radiator is provided with a stepped portion, and fixing spring hardware having slit grooves is provided with a notch engaging with the stepped portion, so that the end of radiator is brought into contact with the outer surface of the semiconductor device when the stepped portion of the radiator engages with the notch portion of the fixing spring hardware. The stepped portion of the radiator is constituted of two stages, and the notch of the fixing spring hardware is provided with two notch portions engaging with the two-stage stepped portions of the radiator, respectively, so that the larger-diameter portion of the two-stage stepped portions of the radiator engages with the farthermost portion of the notch. Further, a male threaded portion is installed near the end of the radiator so that the male threaded portion of the radiator is threadedly fixed to the farthermost portion of the notch of the fixing spring hardware. |
