| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry ashing apparatus wherein the sticking of particles to a wafer in a carrier left standing for a long time on a loader of an ashing device is prevented. SOLUTION: A dry ashing apparatus 1 comprises a loader part 3 where a carrier 5 housing a plurality of wafers is placed, and an ashing process part 6, wherein with the carrier 5 placed on the loader part 3, the wafer is taken out of the carrier one by one for subjecting it to ashing processing with plasma. Here, the carrier 5 on the loader part 3 is covered with a cover 4.
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