| 摘要 |
<p>A solid state image pick-up device comprises an array of a plurality of photodiodes formed on a principal surface of a semiconductor substrate, a planarizing resin layer covering the principal surface of the semiconductor substrate, and a plurality of micro lens formed on the planarizing resin layer, each of micro lens being positioned to correspond to one of the photoelectric conversion elements. The planarizing resin layer is composed of a first region of a first refractive index sandwiched between each of the micro lens and the corresponding photodiode, and a second region surrounding the first region, the second region having a second refractive index larger than the first refractive index.</p> |
