SEMICONDUCTOR PACKAGE INCLUDING SUBSTRATE WITH SLIT

摘要

PURPOSE: A semiconductor package including a substrate with a slit is provided to prevent a resin from being peeled off at an interface between a substrate and the resin, by making the resin filled in the slit when the resin is encapsulated on the substrate in which a semiconductor chip is mounted. CONSTITUTION: A semiconductor package(300) including a substrate with a slit(260) comprises a semiconductor chip(210), a substrate(220), bonding wires(230), a resin(240) and solder balls(250). The semiconductor chip has bonding pads. The substrate includes a top surface and a bottom surface. The top surface has a mounting region where electrode pads corresponding to the bonding pads and the semiconductor chip are mounted. The bottom surface has ball pads electrically connected to the electrode pads on the top surface. The bonding wires electrically connect the bonding pads with the electrode pads. The resin encapsulates an electrical connection part including the semiconductor chip and the bonding wires on the top surface of the substrate. The solder balls are formed on the ball pads. The slit of a predetermined shape is formed on the top surface of the substrate. Adhesion between the resin and the substrate is increased by filling the resin in the slit.