发明名称 PHOTOSENSITIVE POLYMER COMPOSITION, METHOD FOR PRODUCING PATTERN, AND ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a positive type photosensitive polymer composition having high sensitivity, high resolution, a good pattern shape and a good rate of a residual film in the unexposed part, to provide a method for producing a pattern, and to provide electronic parts having high reliability. SOLUTION: The photosensitive polymer composition contains a polyimide or polybenzoxazole precursor having an o-quinone diazide skeleton in at least one end and represented by formula 1, 2 or 3. In the formulae 1-3, each R is H, COOH or COOR'; R' is a monovalent organic group; each R1 is a tetravalent organic group; each R2 is a divalent organic group which may have carboxyl or phenolic hydroxyl; (n) is an integer; each X is a monovalent organic group containing an o-quinone diazide skeleton or hydroxy; and each Y is a monovalent organic group containing an o-quinone diazide skeleton or H.
申请公布号 JP2001125263(A) 申请公布日期 2001.05.11
申请号 JP19990309022 申请日期 1999.10.29
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 OE TADAYUKI;SASAKI MAMORU;ANZAI TAKANORI
分类号 H01L21/027;C08G73/14;C08G73/22;C08L79/04;C08L79/08;G03F7/023;G03F7/037;G03F7/40 主分类号 H01L21/027
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