发明名称 Stepped photoresist profile and opening formed using the profile
摘要 Stepped photoresist profiles provide various methods of forming profiles in an underlying substrate. The stepped photoresist profiles are formed in two layers of photoresist that are disposed over the substrate. The substrate is then etched twice using a respective opening in each photoresist layer to create a stepped profile in the substrate.
申请公布号 US2002111030(A1) 申请公布日期 2002.08.15
申请号 US20010996253 申请日期 2001.11.28
申请人 BATRA SHUBNEESH;PIERRAT CHRISTOPHE 发明人 BATRA SHUBNEESH;PIERRAT CHRISTOPHE
分类号 H01L21/027;H01L21/308;H01L21/768;H01L29/812;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L21/027
代理机构 代理人
主权项
地址