发明名称 LAND FOR CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To eliminate the generation of a short circuit due to solder between adjacent lands in a soldering operation and to obtain a land shape by which a land exfoliation is not generated. SOLUTION: Regarding the land shape of a land 7a and that of a land 7b as parts to which terminals 10a, 10b of an electronic component are soldered and fixed on a circuit board 1, the shapes of the adjacent lands 7a, 7b are formed to be nearly cross-shaped, and the distance between the lands is obtained in such a way that their short circuit is not generated in the soldering operation.
申请公布号 JP2002261429(A) 申请公布日期 2002.09.13
申请号 JP20010053003 申请日期 2001.02.27
申请人 AISIN SEIKI CO LTD 发明人 IIDA TSUKASA
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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