| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding method that prevents break of wire made thin through wedge bonding. SOLUTION: When ball bonding from above a junction area 2 of a wire 1 bonded a lead frame 4, the junction area 2 can be made thick by forming a bonding area 3 performing ball bonding including a wire diameter ϕ portion of the wire 1, and break of the wire wedge bonded has been is prevented because a region where the wire is joined together becomes wide. |
