| 摘要 |
PROBLEM TO BE SOLVED: To provide a control method capable of obtaining accurately a plating film having a prescribed film thickness by detecting the point of time when the plating film obtains the prescribed film thickness.SOLUTION: A monitor substrate (20) where a pattern (5d) for third conduction confirmation disconnected as long as a distance of double of a prescribed film thickness is formed, and an object (2) to be plated are immersed into a plating solution (8), to thereby form a plating film (14). When the pattern (5d) for third conduction confirmation is changed from an insulation state to a conduction state, the monitor substrate (20) and the object (2) to be plated are pulled up from the plating solution (8), and then the plating film (14) has just obtained a prescribed film thickness.SELECTED DRAWING: Figure 1 |
