Top port MEMS microphone package and method

摘要

A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.

主权项

1. An electronic component package comprising:
a substrate comprising a back volume expanding aperture therein; a Micro Electro Mechanical Systems (MEMS) microphone electronic component with a first surface comprising an aperture and a second surface comprising a diaphragm, said first surface coupled to the substrate above a portion of the back volume expanding aperture; and a lid comprising a lid cavity, an inner surface of the lid coupled to the second surface of the MEMS microphone electronic component, the back volume expanding aperture directly connecting the aperture of the MEMS microphone electronic component to the lid cavity such that the aperture of the MEMS microphone electronic component is in fluid communication with the lid cavity.