发明名称 RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
摘要 The resin composition of the present invention comprises (a) a polypropylene-based resin, (b) a polyphenylene ether-based resin, and (c) a first hydrogenated block copolymer-based resin and further comprises (d) an ethylene-α-olefin copolymer rubber and/or (e) a second hydrogenated block copolymer-based resin.
申请公布号 US2016237277(A1) 申请公布日期 2016.08.18
申请号 US201415025583 申请日期 2014.09.26
申请人 ASAHI KASEI KABUSHIKI KAISHA 发明人 I Shunichiro;YAMAMOTO Mihoko
分类号 C08L71/12;C08L23/12 主分类号 C08L71/12
代理机构 代理人
主权项 1. A resin composition comprising (a) a polypropylene-based resin, (b) a polyphenylene ether-based resin, and (c) a first hydrogenated block copolymer-based resin, and further comprising (d) an ethylene-α-olefin copolymer rubber and/or (e) a second hydrogenated block copolymer-based resin, wherein each of the components (c) and (e) is a hydrogenated block copolymer prepared by hydrogenating a block copolymer comprising at least one polymer block A composed mainly of a vinyl aromatic compound and at least one polymer block B composed mainly of a conjugated diene compound, and/or a modified product of the hydrogenated block copolymer, a total ratio of a 1,2-vinyl bond and a 3,4-vinyl bond to all bonds in the conjugated diene compound units in the component (c) is 45 to 90%, the component (c) comprises 30 to 50% by mass of the vinyl aromatic compound units, a total ratio of a 1,2-vinyl bond and a 3,4-vinyl bond to all bonds in the conjugated diene compound units in the component (e) is 25% or more and less than 60%, a rate of hydrogenation of ethylenic double bonds (double bonds in the conjugated diene compound units) in the block copolymer in the component (c) is 80 to 100%, and a rate of hydrogenation of ethylenic double bonds (double bonds in the conjugated diene compound units) in the block copolymer in the component (e) is 10% or higher and lower than 80%.
地址 Tokyo JP
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