| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for a power module which easily enables improvement of adhesion between a circuit layer of the substrate for the power module which is sealed by a mold resin and the mold resin, maintains good bondability of a semiconductor element, and achieves high reliability, and to provide a manufacturing method of a power module which uses the manufacturing method of the substrate for the power module.SOLUTION: A manufacturing method of a substrate for a power module includes an anchor hole etching step in which a circuit layer 10 is etched to form anchor holes 9 which penetrate through a second metal layer 14 and reach at least a mid part of a first metal layer 13. An etchant having an etching rate for the first metal layer 13 which is higher than an etching rate for the second metal layer 14 is used to conduct the anchor hole etching step. Portions, each of which extends to the outer side in a radial direction relative to an opening part of the anchor hole 9 formed in the second metal layer 14, are formed in the first metal layer 13.SELECTED DRAWING: Figure 3 |
