PROCEDE DE REALISATION SIMULTANEE DE LIAISONS ELECTRIQUES MULTIPLES, NOTAMMENT POUR LE RACCORDEMENT ELECTRIQUE D'UNE MICRO-PLAQUETTE DE SEMICONDUCTEURS

摘要

A method for the simultaneous manufacture of multiple electrical connections, in particular for the electrical connection of semiconductor elements. In the method a conductive paste is used. Because the conductive paste would otherwise provide a poor electrical connection with the contact pads which are manufactured of certain metals, the paste is first polymerized and thermo-compression of the paste is then carried out on the contact pad by the simultaneous application of pressure and a rise in temperature so that the paste forms a readily conductive and reliable connection.