| 摘要 |
A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station, at least one alignment station, a cutting means disposed in the cutting station, a detecting means disposed in the alignment station for detecting the cutting lines of the wafer, and a wafer transferring means. The wafer transferring means includes two wafer supporting means and the dicing machine is capable of positioning one of the two wafer supporting means in the alignment station and performing alignment of a semiconductor wafer supported with said one of the wafer supporting means while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means. The cutting means includes two cutting blades and a cutting blade interval setting-up means for setting up the interval of these cutting blades.
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