| 摘要 |
PURPOSE:To easily and stably form a bump on an aluminum electrode on a semiconductor element, and to perform a uniform bond even if the number of leads is increased by forming the bump by a pole bonding of a copper wire to the aluminum electrode, and supplying insertion metal between the bump and the lead of a tape carrier, and heating to melt it to bond both. CONSTITUTION:A bump 12 is formed by pole bonding a copper wire 10 to an aluminum electrode 4 on a semiconductor element 3 by using a capillary chip 11 and then breaking the wire 10 at the top of a tension pole (pole neck). The thus formed bump 12 is aligned with the lead 2 of a tape carrier, an insertion metal 12 is supplied between the bump and the lead, heated to be melted to bond therebetween. These series of processes are conducted in an inert atmosphere of argon or the like or a reducing atmosphere in which hydrogen is mixed so as to prevent the copper from oxidizing. |
