| 摘要 |
PURPOSE:To prevent a short circuit caused by the bending of a thin conductor wire at resin sealing by a method wherein pre-coating material is made to drip on an inner lead before it is sealed up with resin, and the connection part of a thin conductor wire with the inner lead and a part around it are covered with the pre-coating material concerned. CONSTITUTION:A semiconductor element 3 is mounted on an island 2 of a lead frame 1 and fixed to it by brazing material 4. An electrode 3a of the semiconductor element 3 is connected to an inner lead 5 with a fine conductor wire 6. Moreover, a pre-coating material 7 is applied onto the connection part of the inner lead 5 with the thin conductor wire 6, and cured to fixedly to cover the conductor wire 6. In this case, as the thin conductor wire 6 is fixed onto the inner lead 5 with the pre-coating material 7, the fixed part concerned and a part near it are enhanced in strength. By this setup, a short circuit caused by the bending of a thin conductor wire can be prevented from occurring at resin sealing. |
