CHIP MOUNT STRUCTURE IN THIN ELECTRONIC EQUIPMENT

摘要

PURPOSE:To prevent the crack of a chip or the peeling of an external electrode even if a thin electronic equipment is bent or a depressing force is applied to the chip. CONSTITUTION:A chip containing hole 10C and a spring containing hole 10D are provided in a printed board 10. A chip 1 is contained in the chip containing hole 10C. A spring 12 is set in the spring containing hole 10D. In this structure, a beam 13D is deflected into the chip containing hole 10C, and external electrodes 1A, 1B of the chip 1 are brought into contact with conductor patterns 10A, 10B.