| 摘要 |
PROBLEM TO BE SOLVED: To protect a semiconductor device against breakdown in a marking process. SOLUTION: An aluminum plate 12 is joined to the rear of a semiconductor element 3 through the intermediary of a heat dissipating grease 13 as adhesive agent, and a mark 9 is annexed to the aluminum plate 12. As the aluminum plate 12 is provided, even if the mark 9 is engraved in the plate 12 with a laser beam, only the surface of the plate 12 is cut, so that the semiconductor element 3 can be protected against a shock and cracking induced by a laser beam at marking, and a circuit and others provided to the surface of the semiconductor element 3 can be protected against, damage and an adverse effect on them in characteristics. Heat, released from the semiconductor element 3 is transmitted through the aluminum plate 12 to be dissipated. |
