| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of die bonding capable of preventing dislocation of a chip caused by a deformed adhesive wafer sheet when the adhesive sheet is excessively heated. SOLUTION: A bond is softened by heating the adhesive sheet 3 for a wafer 1 with a heater 22. A chip 4 pushed up by a needle 16 is picked up by a collet 33 and shifted onto a board 34. A counter 45 measures a time until the collet 33 returns again above the wafer 1 and picks up the next chip 4. When the measured time is longer than a given set time, the position of the chip 4 is recognized by a camera 36. After the position of the chip 4 is compensated by driving an X-Y table 6 in accordance with the recongnized result, the chip 4 is picked up by the collet 33.</p> |
