发明名称 PHOTORESIST SPRAY DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a photoresist spray device which prevents bubbles from being contained in applied photoresist by a method wherein the photoresist spray device is equipped with a tank which is filled with photoresist, and photoresist is supplied through the tank. SOLUTION: When a valve 145 is opened, nitrogen gas is made to flow through the gas inlet pipe 141 of a gas pipe 140. Thereafter, when nitrogen gas is discharged out through a gas exhaust vent 142, air inside the tank 110 is also discharged out through the gas exhaust vent 142. By this setup, the tank 110 is reduced in inner pressure, and photoresist is made to flow into the tank 110 from outside. The valve 145 is closed, nitrogen gas which is injected through the gas inlet pipe 141 of the gas pipe 140 is made to flow into the tank 110, and photoresist 115 inside the tank 110 is sprayed onto a semiconductor wafer through the photoresist exhaust vent 156 of a photoresist exhaust pipe 155.</p>
申请公布号 JPH09260282(A) 申请公布日期 1997.10.03
申请号 JP19970027791 申请日期 1997.02.12
申请人 SAMSUNG ELECTRON CO LTD 发明人 RI KIMEI;CHIYOU ITSUCHIN
分类号 H01L21/027;B05B9/04;G03F7/16;H01L21/312;(IPC1-7):H01L21/027 主分类号 H01L21/027
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