| 摘要 |
PROBLEM TO BE SOLVED: To provide the resin composition useful as a chemical sensitization type positive resist superior in resolution, sectional pattern forms, resistance to irradiation with radiation and baking (PED), and process stability and small in influence of stationary wave and high resistance to heat. SOLUTION: This resin composition comprises (A) a copolymer of repeating units (1) having a structure to be decomposed by action of acid and to be increased in solubility in a developing solution and repeating units (2) obtained by cleaving the C=C double bond of a compound having >=2 (meth)acryloyl groups, and the copolymer (A) being solubilized in an alkaline developing solution by action of acid, and (B) a radiation sensitive acid generating agent to be allowed to generate acid by irradiation with radiation. |
