| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing method and a plasma processing system employing an electrostatic suction unit in which adhesion of particles to a semiconductor substrate is reduced. SOLUTION: In the plasma processing system employing an electrostatic suction unit 1, a semiconductor substrate 4 is charged negatively by applying a minus voltage to a suction electrode 2 which has been applied with a plus voltage before a plasma 5 disappears and then the plasma is extinguished. |
