| 摘要 |
PROBLEM TO BE SOLVED: To prevent misregistration of a semiconductor chip part to a substrate. SOLUTION: A bump 12 provided on an electrode pad 2 of a semiconductor chip part 1 is constituted of a first plating part 12a, a tubular second plating part 12b formed on the first plating part 12a, and a third plating part 12c formed to almost a mushroom shape from an inside of the second plating part 12b to an upper end thereof. A solder material whose melting point is lower than that of the first and second plating parts 12a, 12b is used for the third plating part 12c, a metallic support 14 with an outer diameter which is smaller than an inner diameter of the second plating part 12b is formed on an electrode pad 13 of a substrate 7, and the third plating part 12c is melted. As a result, the metallic support 14 is buried inside the second plating part 12b. |
